Elite EMI Armour

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Elite EMI Armour Sheets

  Nanotech Elite EMI Armour is a thin, scratch-resistant and lightweight conductive polyurethane sheet produced based on Nanotech Premium Graphene and silver-coated copper flakes. It offers superior EMI shielding properties along with excellent thermal conductivity, mechanical and structural integrity, and corrosion resistivity. Unlike conventional metal foils and meshes, Nanotech Elite EMI Armour sheets are mechanically … Continue reading “Elite EMI Armour Sheets”



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Overview

 

Nanotech Elite EMI Armour is a thin, scratch-resistant and lightweight conductive polyurethane sheet produced based on Nanotech Premium Graphene and silver-coated copper flakes. It offers superior EMI shielding properties along with excellent thermal conductivity, mechanical and structural integrity, and corrosion resistivity. Unlike conventional metal foils and meshes, Nanotech Elite EMI Armour sheets are mechanically robust, corrosion-resistant, and offer processing advantages.

 

The light and flexible sheets are designed to contain or block internal and external electromagnetic interferences. We offer the shielding sheets in various sizes to meet the diverse requirements for EMI shielding applications. The material is easy to process and can be cut into customizable shapes. With excellent thermal conductivity, this product can also be used to dissipate heat from power electronics.

 

Product Uses:

 

This product can be used as a thin, flexible, scratch-resistant and lightweight conductive sheet offering superior EMI shielding properties along with excellent thermal conductivity, mechanical flexibility, and structural integrity. with its thin form factor, it can prevent electromagnetic shielding from impacting sensitive electronics. The Elite EMI Shielding materials can be an excellent solution for heat dissipation and as a thermal interface for heat sinking applications. These features are critical for modern technology, in which heat sinks utilize conduction and convection for heat dissipation in order to avoid a thermal shutdown.