Electronic packaging plays an important role in the modern semiconductor industry. Normally, lead/tin solders are widely applied for die attaching and terminal bonding of different electronic components. However, worldwide regulations are against the use of lead in products due to its damaging health effects. Besides, Pb/Sn soldering has limited patterning resolution that cannot satisfy the increasing demands of modern electronics packaging. This has triggered a lot of research efforts for the elimination of lead from interconnect materials and for finding alternative conductive adhesives. Since the first demonstration of silver filled thermosetting polymer resins, electrically conductive adhesives has presented an effective solution for bonding surface mount devices to printed circuit boards. These adhesives have several advantages including low curing temperature, mechanical flexibility as well as improved environmental effects.
Nanotech Energy is developing electrically conducting adhesives based on graphene for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. Graphene exhibits unique structural properties, providing high electrical and thermal conductivity with excellent bond strength. Within the next three months, we will be releasing two products: the first is conductive epoxy and the other is one part superglue adhesive that develops strong, durable, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass, and plastic laminates. The products cure at room temperature and can be used as a cold solder for heat-sensitive components where hot-soldering is impractical.
The use of adhesives offers many advantages over binding techniques such as sewing, mechanical fastening, thermal bonding, etc. Although lead/tin solders have been used in the electronic industry for many years, they require high temperatures for operation, meaning that it cannot be used with heat-sensitive materials.
Our conductive adhesives can be used as an alternative to lead-based solders. Their low curing temperatures provide a completely safe solution for bonding heat-sensitive components during manufacturing. They can be used for the assembly and repair of electrical modules, waveguides, flat cables, and high-frequency shields. These adhesives can also find extensive applications in bonding semiconductor chips, integrated monolithic circuits, diodes, transistors, and other components in thin film and thick film hybrid microelectronic circuits.
Measurements indicate that our adhesives bond strongly to glass, plastic, ceramic, graphite, quartz, and other materials as well.
Why conductive adhesives?
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